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34 .807ireless important notice dear customer, as from august 2 nd 2008, the wireless operations of nxp have moved to a new company, st-nxp wireless. as a result, the following changes are applicable to the attached document. company name - philips semiconductors is replaced with st-nxp wireless . copyright - the copyright notice at the botto m of each page ?? koninklijke philips electronics n.v. 200x. all rights reserved?, shall now read: ?? st-nxp wireless 200x - all rights reserved?. web site - http://www.semiconductors.philips.com is replaced with http://www.stnwireless.com contact information - the list of sales offices previous ly obtained by sending an email to sales.addresses@www.semiconductors.philips.com , is now found at http://www.stnwireless.com under contacts. if you have any questions related to the document, please contact our nearest sales office. thank you for your cooperation and understanding. st-nxp wireless 34 .807ireless www.stnwireless.com
isp1105/1106 advanced universal serial bus transceivers rev. 08 19 february 2004 product data 1. general description the isp1105/1106 range of universal serial bus (usb) transceivers are compliant with the universal serial bus speci?cation rev. 2.0 . they can transmit and receive serial data at both full-speed (12 mbit/s) and low-speed (1.5 mbit/s) data rates. the isp1105/1106 range can be used as a usb device transceiver or a usb host transceiver. they allow usb application speci?c ics (asics) and programmable logic devices (plds) with power supply voltages from 1.65 v to 3.6 v to interface with the physical layer of the universal serial bus. they have an integrated 5 v-to-3.3 v voltage regulator for direct powering via the usb supply v bus . isp1105 allows single-ended and differential input modes selectable by a mode input and it is available in hvqfn16 and hbcc16 packages. isp1106 allows only differential input mode and is available in both tssop16 and hbcc16 packages. the isp1105/1106 are ideal for portable electronics devices such as mobile phones, digital still cameras, personal digital assistants (pda) and information appliances (ia). 2. features n complies with universal serial bus speci?cation rev. 2.0 n can transmit and receive serial data at both full-speed (12 mbit/s) and low-speed (1.5 mbit/s) data rates n integrated bypassable 5 v-to-3.3 v voltage regulator for powering via usb v bus n v bus disconnection indication through vp and vm n used as a usb device transceiver or a usb host transceiver n stable rcv output during se0 condition n two single-ended receivers with hysteresis n low-power operation n supports an i/o voltage range from 1.65 v to 3.6 v n 12 kv esd protection at the d+, d - , v cc(5.0) and gnd pins n full industrial operating temperature range from - 40 to + 85 c n available in small hbcc16, hvqfn16 (only isp1105) and tssop16 (only isp1106) packages; hbcc16 and hvqfn16 are lead-free and halogen-free packages.
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 2 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 3. applications n portable electronic devices, such as: u mobile phone u digital still camera u personal digital assistant (pda) u information appliance (ia). 4. ordering information 4.1 ordering options table 1: ordering information type number package name description version isp1105bs hvqfn16 plastic thermal enhanced very thin quad ?at package; no leads; 16 terminals; body 3 3 0.85 mm sot758-1 isp1105w hbcc16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 3 0.65 mm sot639-2 isp1106dh tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 isp1106w hbcc16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 3 0.65 mm sot639-2 table 2: selection guide product package description isp1105 hvqfn16 and hbcc16 supports both single-ended and differential input modes; see ta b l e 5 and ta b l e 6 . isp1106 tssop16 and hbcc16 supports only the differential input mode; see ta b l e 6 .
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 3 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 5. block diagram (1) connect to d - for low-speed operation. (2) pin function depends on device type. (3) only for isp1105. fig 1. block diagram (combined isp1105 and isp1106). mbl301 v cc(i/o) v cc(5.0) voltage regulator 3.3 v 1.5 k w (1) 33 w (1%) 33 w (1%) level shifter isp1105 isp1106 softcon speed v reg(3.3) gnd v pu(3.3) d + d - oe vmo/fse0 (2) vpo/vo (2) mode (3) suspnd rcv vp vm
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 4 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 6. pinning information 6.1 pinning fig 2. pin con?guration isp1105bs (hvqfn). fig 3. pin con?guration isp1105w (hbcc16). 004aaa314 isp1105bs d - d+ mode suspnd vpo/vo vmo/fse0 8 gnd (exposed diepad) v cc(i/o) 56 7 4 3 2 9 10 11 13 14 15 16 speed 1 12 bottom view rcv vp oe vm v pu(3.3) softcon v cc(5.0) v reg(3.3) mbl303 bottom view isp1105w softcon v pu(3.3) rcv vp oe d + d - speed v cc(i/o) vpo/vo vm suspnd mode v cc(5.0) v reg(3.3) vmo/fse0 13 14 15 16 8 7 6 12 11 10 9 2 1 3 4 5 gnd (exposed diepad) fig 4. pin con?guration isp1106dh (tssop16). fig 5. pin con?guration isp1106w (hbcc16). isp1106dh mbl302 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 v pu(3.3) softcon oe rcv vp vm suspnd gnd v cc(i/o) speed d - d + vpo vmo v reg(3.3) v cc(5.0) mbl304 bottom view isp1106w softcon v pu(3.3) rcv vp oe d + d - speed v cc(i/o) vpo vm suspnd gnd v cc(5.0) v reg(3.3) vmo 13 14 15 16 8 7 6 12 11 10 9 2 1 3 4 5
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 5 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 6.2 pin description table 3: pin description symbol [1] pin type description isp1105 isp1106 bs w dh w oe 1131i output enable input (cmos level with respect to v cc(i/o) , active low); enables the transceiver to transmit data on the usb bus input pad; push pull; cmos rcv 2242o differential data receiver output (cmos level with respect to v cc(i/o) ); driven low when input suspnd is high; the output state of rcv is preserved and stable during an se0 condition output pad; push pull; 4 ma output drive; cmos vp 3353o single-ended d + receiver output (cmos level with respect to v cc(i/o) ); for external detection of single-ended zero (se0), error conditions, speed of connected device; driven high when no supply voltage is connected to v cc(5.0) and v reg(3.3) output pad; push pull; 4 ma output drive; cmos vm 4464o single-ended d - receiver output (cmos level with respect to v cc(i/o) ); for external detection of single-ended zero (se0), error conditions, speed of connected device; driven high when no supply voltage is connected to v cc(5.0) and v reg(3.3) output pad; push pull; 4 ma output drive; cmos suspnd 5575i suspend input (cmos level with respect to v cc(i/o) ); a high level enables low-power state while the usb bus is inactive and drives output rcv to a low level input pad; push pull; cmos mode 6 6 - - i mode input (cmos level with respect to v cc(i/o) ); a high level enables the differential input mode (vpo, vmo) whereas a low level enables a single-ended input mode (vo, fse0); see ta bl e 5 and ta b l e 6 input pad; push pull; cmos gnd die pad die pad 8 6 - ground supply [2] v cc(i/o) 7797- supply voltage for digital i/o pins (1.65 to 3.6 v). when v cc(i/o) is not connected, the (d +, d - ) pins are in three-state; this supply pin is totally independent of v cc(5.0) and v reg(3.3) and must never exceed the v reg(3.3) voltage speed 8 8 10 8 i speed selection input (cmos level with respect to v cc(i/o) ); adjusts the slew rate of differential data outputs d + and d - according to the transmission speed low low-speed (1.5 mbit/s) high full-speed (12 mbit/s) input pad; push pull; cmos d - 9 9 11 9 ai/o negative usb data bus connection (analog, differential); for low-speed mode connect to pin v pu(3.3) via a 1.5 k w resistor d + 10 10 12 10 ai/o positive usb data bus connection (analog, differential); for full-speed mode connect to pin v pu(3.3) via a 1.5 k w resistor
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 6 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. [1] symbol names with an overscore (e.g. name) indicate active low signals. [2] isp1105: ground terminal is connected to the exposed die pad (heatsink). vpo/vo 11 11 - - i driver data input (cmos level with respect to v cc(i/o) , schmitt trigger); see ta b l e 5 and ta b l e 6 input pad; push pull; cmos vpo - - 13 11 vo ---- vmo/fse0 12 12 - - i driver data input (cmos level with respect to v cc(i/o) , schmitt trigger); see ta b l e 5 and ta b l e 6 input pad; push pull; cmos vmo - - 14 12 fse0 - - - - v reg(3.3) 13 13 15 13 - internal regulator option: regulated supply voltage output (3.0 to 3.6 v) during 5 v operation; a decoupling capacitor of at least 0.1 m f is required regulator bypass option: used as a supply voltage input for 3.3 v 10% operation v cc(5.0) 14 14 16 14 - internal regulator option: supply voltage input (4.0 to 5.5 v); can be connected directly to usb supply v bus regulator bypass option: connect to v reg(3.3) v pu(3.3) 15 15 1 15 - pull-up supply voltage (3.3 v 10%); connect an external 1.5 k w resistor on d + (full-speed) or d - (low-speed); pin function is controlled by input softcon softcon = low v pu(3.3) ?oating (high impedance); ensures zero pull-up current softcon = high v pu(3.3) = 3.3 v; internally connected to v reg(3.3) softcon 16 16 2 16 i software controlled usb connection input; a high level applies 3.3 v to pin v pu(3.3) , which is connected to an external 1.5 k w pull-up resistor; this allows usb connect/disconnect signalling to be controlled by software input pad; push pull; cmos table 3: pin description continued symbol [1] pin type description isp1105 isp1106 bs w dh w
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 7 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 7. functional description 7.1 function selection [1] signal levels on (d + , d -) are determined by other usb devices and external pull-up/down resistors. [2] in suspend mode (suspnd = high) the differential receiver is inactive and output rcv is always low. out-of-suspend (k) signalling is detected via the single-ended receivers vp and vm. [3] during suspend, the slew-rate control circuit of low-speed operation is disabled. the (d + , d -) lines are still driven to their intended states, without slew-rate control. this is permitted because driving during suspend is used to signal remote wake-up by driving a k signal (one transition from idle to k state) for a period of 1 to 15 ms. 7.2 operating functions [1] vp = vm = h indicates the sharing mode (v cc(5.0) and v reg(3.3) are disconnected). [2] rcv* denotes the signal level on output rcv just before se0 state occurs. this level is stable during the se0 period. table 4: function table suspnd oe (d + , d - ) rcv vp/vm function l l driving and receiving active active normal driving (differential receiver active) l h receiving [1] active active receiving h l driving inactive [2] active driving during suspend [3] (differential receiver inactive) h h high-z [1] inactive [2] active low-power state table 5: driving function (pin oe = l) using single-ended input data interface for isp1105 (pin mode = l) fse0 vo data l l differential logic 0 l h differential logic 1 h l se0 h h se0 table 6: driving function (pin oe = l) using differential input data interface for isp1105 (pin mode = h) and isp1106 vmo vpo data l l se0 l h differential logic 1 h l differential logic 0 h h illegal state table 7: receiving function (pin oe=h) (d + , d - ) rcv vp [1] vm [1] differential logic 0 l l h differential logic 1 h h l se0 rcv* [2] ll
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 8 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 7.3 power supply con?gurations the isp1105/1106 can be used with different power supply con?gurations, which can be changed dynamically. an overview is given in ta b l e 9 . normal mode both v cc(i/o) and v cc(5.0) or (v cc(5.0) and v reg(3.3) ) are connected. for 5 v operation, v cc(5.0) is connected to a 5 v source (4.0 to 5.5 v). the internal voltage regulator then produces 3.3 v for the usb connections. for 3.3 v operation, both v cc(5.0) and v reg(3.3) are connected to a 3.3 v source (3.0 to 3.6 v). v cc(i/o) is independently connected to a voltage source (1.65 v to 3.6 v), depending on the supply voltage of the external circuit. disable mode v cc(i/o) is not connected, v cc(5.0) or (v cc(5.0) and v reg(3.3) ) are connected. in this mode, the internal circuits of the isp1105/1106 ensure that the (d + , d - ) pins are in three-state and the power consumption drops to the low-power (suspended) state level. some hysteresis is built into the detection of v cc(i/o) lost. sharing mode v cc(i/o) is connected, (v cc(5.0) and v reg(3.3) ) are not connected. in this mode, the (d + , d - ) pins are made three-state and the isp1105/1106 allows external signals of up to 3.6 v to share the (d +, d - ) lines. the internal circuits of the isp1105/1106 ensure that virtually no current (maximum 10 m a) is drawn via the (d +, d - ) lines. the power consumption through pin v cc(i/o) drops to the low-power (suspended) state level. both the vp and vm pins are driven high to indicate this mode. pin rcv is made low. some hysteresis is built into the detection of v reg(3.3) lost. [1] high impedance or driven low. [2] isp1105 only. table 8: pin states in disable or sharing mode pins disable mode state sharing mode state v cc(5.0) / v reg(3.3) 5 v input / 3.3 v output; 3.3 v input / 3.3 v input not present v cc(i/o) not present 1.65 v to 3.6 v input v pu(3.3) high impedance (off) high impedance (off) (d + , d -) high impedance high impedance (vp, vm) invalid [1] h rcv invalid [1] l inputs (vo/vpo, fse0/vmo, speed, mode [2] , suspnd, oe, softcon) high impedance high impedance
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 9 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. [1] high impedance or driven low. 7.4 power supply input options the isp1105/1106 range has two power supply input options. internal regulator v cc(5.0) is connected to 4.0 to 5.5 v. the internal regulator is used to supply the internal circuitry with 3.3 v (nominal). the v reg(3.3) pin becomes a 3.3 v output reference. regulator bypass v cc(5.0) and v reg(3.3) are connected to the same supply. the internal regulator is bypassed and the internal circuitry is supplied directly from the v reg(3.3) power supply. the voltage range is 3.0 to 3.6 v to comply with the usb speci?cation. the supply voltage range for each input option is speci?ed in ta b l e 1 0 . table 9: power supply con?guration overview v cc(5.0) or v reg(3.3) v cc(i/o) con?guration special characteristics connected connected normal mode - connected not connected disable mode (d + , d -) and v pu(3.3) high impedance; vp, vm, rcv: invalid [1] not connected connected sharing mode (d + , d -) and v pu(3.3) high impedance; vp, vm driven high; rcv driven low table 10: power supply input options input option v cc(5.0) v reg(3.3) v cc(i/o) internal regulator supply input for internal regulator (4.0 to 5.5 v) voltage reference output (3.3 v, 300 m a) supply input for digital i/o pins (1.65 v to 3.6 v) regulator bypass connected to v reg(3.3) with maximum voltage drop of 0.3 v (2.7 to 3.6 v) supply input (3.0 v to 3.6 v) supply input for digital i/o pins (1.65 v to 3.6 v)
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 10 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 8. electrostatic discharge (esd) 8.1 esd protection the pins that are connected to the usb connector (d+, d - ,v cc(5.0) and gnd) have a minimum of 12 kv esd protection. the 12 kv measurement is limited by the test equipment. capacitors of 4.7 m f connected from v reg(3.3) to gnd and v cc(5.0) to gnd are required to achieve this 12 kv esd protection (see figure 6 ). isp1105/1106 can withstand 12 kv using the human body model and 5 kv using the contact discharge method as speci?ed in iec 61000-4-2 . 8.2 esd test conditions a detailed report on test set-up and results is available on request. fig 6. human body esd test model. 1 m w 1500 w high voltage dc source 4.7 m f 4.7 m f r c r d v cc(5.0) v reg(3.3) device under test c s 100 pf storage capacitor charge current limit resistor discharge resistance gnd a b 004aaa145
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 11 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 9. limiting values [1] testing equipment limits measurement to only 12 kv. capacitors needed on v cc(5.0) and v reg(3.3) ; see section 8 . [2] equivalent to discharging a 100 pf capacitor via a 1.5 k w resistor (human body model). 10. recommended operating conditions table 11: absolute maximum ratings in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc(5.0) supply voltage - 0.5 + 6.0 v v cc(i/o) i/o supply voltage - 0.5 +4.6 v v reg(3.3) regulated supply voltage - 0.5 +4.6 v v i dc input voltage - 0.5 v cc(i/o) + 0.5 v i lu latch-up current v i =- 1.8 to 5.4 v - 100 ma v esd electrostatic discharge voltage i li <1 m a [1][2] on pins d + , d - , v cc(5.0) and gnd - 12000 + 12000 v on other pins - 2000 + 2000 v t stg storage temperature - 40 + 125 c table 12: recommended operating conditions symbol parameter conditions min typ max unit v cc(5.0) supply voltage (internal regulator option) 5 v operation 4.0 5.0 5.5 v v reg(3.3) supply voltage (regulator bypass option) 3.3 v operation 3.0 3.3 3.6 v v cc(i/o) i/o supply voltage 1.65 - 3.6 v v i input voltage 0 - v cc(i/o) v v i(ai/o) input voltage on analog i/o pins (d + /d - ) 0 - 3.6 v t amb operating ambient temperature - 40 - + 85 c
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 12 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 11. static characteristics [1] i load includes the pull-up resistor current via pin v pu(3.3) . [2] in suspend mode, the minimum voltage is 2.7 v. [3] maximum value is characterized only, not tested in production. [4] excluding any load current and v pu(3.3) /v sw source current to the 1.5 k w and 15 k w pull-up and pull-down resistors (200 m a typ.). [5] when v cc(i/o) < 2.7 v, the minimum value for v th(reg3.3)(present) is 2.0 v. table 13: static characteristics: supply pins v cc = 4.0 to 5.5 v or v reg(3.3) = 3.0 to 3.6 v; v cc(i/o) = 1.65 to 3.6 v; v gnd = 0 v; see ta b l e 1 0 for valid voltage level combinations; t amb = - 40 to + 85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit v reg(3.3) regulated supply voltage output internal regulator option; i load 300 m a [1][2] 3.0 3.3 3.6 v i cc operating supply current full-speed transmitting and receiving at 12 mbit/s; c l =50pf on d + /d - [3] - 48ma i cc(i/o) operating i/o supply current full-speed transmitting and receiving at 12 mbit/s [3] - 12ma i cc(idle) supply current during full-speed idle and se0 full-speed idle: v d + > 2.7 v, v d - < 0.3 v; se0: v d + < 0.3 v, v d - < 0.3 v [4] - - 500 m a i cc(i/o)(static) static i/o supply current full-speed idle, se0 or suspend - - 20 m a i cc(susp) suspend supply current suspnd = high [4] --20 m a i cc(dis) disable mode supply current v cc(i/o) not connected [4] --20 m a i cc(i/o)(sharing) sharing mode i/o supply current v cc(5.0) or v reg(3.3) not connected - - 20 m a i dx(sharing) sharing mode load current on pins d + and d - v cc(5.0) or v reg(3.3) not connected; softcon = low; v dx = 3.6 v --10 m a v reg(3.3)th regulated supply voltage detection threshold 1.65 v v cc(i/o) v reg(3.3) ; 2.7 v v reg(3.3) 3.6 v supply lost - - 0.8 v supply present [5] 2.4 - - v v reg(3.3)hys regulated supply voltage detection hysteresis v cc(i/o) = 1.8 v - 0.45 - v v cc(i/o)th i/o supply voltage detection threshold v reg(3.3) = 2.7 to 3.6 v supply lost - - 0.5 v supply present 1.4 - - v v cc(i/o)hys i/o supply voltage detection hysteresis v reg(3.3) = 3.3 v - 0.45 - v
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 13 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. table 14: static characteristics: digital pins v cc(i/o) = 1.65 to 3.6 v; v gnd =0v; t amb = - 40 to + 85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit v cc(i/o) = 1.65 to 3.6 v input levels v il low-level input voltage - - 0.3v cc(i/o) v v ih high-level input voltage 0.6v cc(i/o) -- v output levels v ol low-level output voltage i ol = 100 m a - - 0.15 v i ol = 2 ma - - 0.4 v v oh high-level output voltage i oh = 100 m av cc(i/o) - 0.15 - - v i oh = 2 ma v cc(i/o) - 0.4 - - v leakage current i li input leakage current - 1- + 1 m a example 1: v cc(i/o) = 1.8 v 0.15 v input levels v il low-level input voltage - - 0.5 v v ih high-level input voltage 1.2 - - v output levels v ol low-level output voltage i ol = 100 m a - - 0.15 v i ol = 2 ma - - 0.4 v v oh high-level output voltage i oh = 100 m a 1.5 - - v i oh = 2 ma 1.25 - - v example 2: v cc(i/o) = 2.5 v 0.2 v input levels v il low-level input voltage - - 0.7 v v ih high-level input voltage 1.7 - - v output levels v ol low-level output voltage i ol = 100 m a - - 0.15 v i ol = 2 ma - - 0.4 v v oh high-level output voltage i oh = 100 m a 2.15 - - v i oh = 2 ma 1.9 - - v example 3: v cc(i/o) = 3.3 v 0.3 v input levels v il low-level input voltage - - 0.9 v v ih high-level input voltage 2.15 - - v output levels v ol low-level output voltage i ol = 100 m a - - 0.15 v i ol = 2 ma - - 0.4 v v oh high-level output voltage i oh = 100 m a 2.85 - - v i oh = 2 ma 2.6 - - v capacitance c in input capacitance pin to gnd - - 10 pf
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 14 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. [1] v oh(min) =v reg(3.3) - 0.2 v. [2] includes external resistors of 33 w 1% on both d + and d - . [3] this voltage is available at pins v reg(3.3) and v pu(3.3) . [4] in suspend mode the minimum voltage is 2.7 v. table 15: static characteristics: analog i/o pins (d + , d - ) v cc = 4.0 to 5.5 v or v reg(3.3) = 3.0 to 3.6 v; v gnd =0v; t amb = - 40 to + 85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit input levels differential receiver v di differential input sensitivity | v i(d + ) - v i(d - ) | 0.2 - - v v cm differential common mode voltage includes v di range 0.8 - 2.5 v single-ended receiver v il low-level input voltage - - 0.8 v v ih high-level input voltage 2.0 - - v v hys hysteresis voltage 0.4 - 0.7 v output levels v ol low-level output voltage r l = 1.5 k w to +3.6 v - - 0.3 v v oh high-level output voltage r l =15k w to gnd [1] 2.8 - 3.6 v leakage current i lz off-state leakage current - 1- +1 m a capacitance c in transceiver capacitance pin to gnd - - 20 pf resistance z drv driver output impedance steady-state drive [2] 34 39 44 w z inp input impedance 10 - - m w r sw internal switch resistance at pin v pu(3.3) --10 w termination v term termination voltage for upstream port pull-up (r pu ) [3][4] 3.0 - 3.6 v
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 15 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 12. dynamic characteristics table 16: dynamic characteristics: analog i/o pins (d + , d - ) [1] v cc = 4.0 to 5.5 v or v reg(3.3) = 3.0 to 3.6 v; v cc(i/o) = 1.65 to 3.6 v; v gnd = 0 v; see ta b l e 1 0 for valid voltage level combinations; t amb = - 40 to + 85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit driver characteristics full-speed mode t fr rise time c l = 50 to 125 pf; 10% to 90% of | v oh - v ol | ; see figure 7 4 - 20 ns t ff fall time c l = 50 to 125 pf; 90% to 10% of | v oh - v ol | ; see figure 7 4 - 20 ns frfm differential rise/fall time matching (t fr /t ff ) excluding the ?rst transition from idle state 90 - 111.1 % v crs output signal crossover voltage excluding the ?rst transition from idle state; see figure 10 [2] 1.3 - 2.0 v low-speed mode t lr rise time c l = 50 to 600 pf; 10% to 90% of | v oh - v ol | ; see figure 7 75 - 300 ns t lf fall time c l = 50 to 600 pf; 90% to 10% of | v oh - v ol | ; see figure 7 75 - 300 ns lrfm differential rise/fall time matching (t lr /t lf ) excluding the ?rst transition from idle state 80 - 125 % v crs output signal crossover voltage excluding the ?rst transition from idle state; see figure 10 [2] 1.3 - 2.0 v driver timing full-speed mode t plh(drv) driver propagation delay (vo/vpo, fse0/vmo to d + ,d - ) low-to-high; see figure 10 --18ns t phl(drv) driver propagation delay (vo/vpo, fse0/vmo to d + ,d - ) high-to-low; see figure 10 --18ns t phz driver disable delay ( oe to d + ,d - ) high-to-off; see figure 8 --15ns t plz driver disable delay ( oe to d + ,d - ) low-to-off; see figure 8 --15ns t pzh driver enable delay ( oe to d + ,d - ) off-to-high; see figure 8 --15ns t pzl driver enable delay ( oe to d + ,d - ) off-to-low; see figure 8 --15ns low-speed mode not speci?ed : low-speed delay timings are dominated by the slow rise/fall times t lr and t lf .
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 16 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. [1] test circuit: see figure 13 . [2] characterized only, not tested. limits guaranteed by design. receiver timings (full-speed and low-speed mode) differential receiver t plh(rcv) propagation delay (d + ,d - to rcv) low-to-high; see figure 9 --15ns t phl(rcv) propagation delay (d + ,d - to rcv) high-to-low; see figure 9 --15ns single-ended receiver t plh(se) propagation delay (d + ,d - to vp, vm) low-to-high; see figure 9 --18ns t phl(se) propagation delay (d + ,d - to vp, vm) high-to-low; see figure 9 --18ns table 16: dynamic characteristics: analog i/o pins (d + , d - ) [1] continued v cc = 4.0 to 5.5 v or v reg(3.3) = 3.0 to 3.6 v; v cc(i/o) = 1.65 to 3.6 v; v gnd = 0 v; see ta b l e 1 0 for valid voltage level combinations; t amb = - 40 to + 85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit fig 7. rise and fall times. fig 8. timing of oe to d + , d - . fig 9. timing of d + , d - to rcv, vp, vm. fig 10. timing of vo/vpo, fse0/vmo to d + , d - . mgs963 v ol t fr , t lr t ff , t lf v oh 90 % 10 % 10 % 90 % mgs966 v ol v oh t pzh t pzl t phz t plz v oh - 0.3 v v ol + 0.3 v v crs 0.9 v 0.9 v 1.8 v 0 v logic input differential data lines mgs965 v ol v oh t phl(rcv) t phl(se) t plh(rcv) t plh(se) v crs v crs 0.9 v 0.9 v 2.0 v 0.8 v logic output differential data lines mgs964 v ol v oh t phl(drv) t plh(drv) v crs v crs 0.9 v 0.9 v 1.8 v 0 v logic input differential data lines
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 17 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 13. test information v = 0 v for t pzh , t phz v=v reg(/3.3) for t pzl , t plz fig 11. load for enable and disable times. fig 12. load for vm, vp and rcv. load capacitance: c l = 50 pf or 125 pf (full-speed mode, minimum or maximum timing) c l = 50 pf or 600 pf (low-speed mode, minimum or maximum timing) (1) full-speed mode: connected to d + ; low-speed mode: connected to d - . fig 13. load for d + , d - . test point v 33 w d.u.t. 500 w 50 pf mbl142 mgs968 25 pf test point d.u.t. mgs967 c l test point 15 k w d + /d - v pu(3.3) 1.5 k w (1) 33 w d.u.t.
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 18 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 14. package outline fig 14. hbcc16 package outline. 2.5 a 1 b a 2 unit d e h e 1 references outline version european projection issue date 01-11-13 03-03-12 iec jedec jeita mm 0.8 0.10 0.05 0.7 0.6 3.1 2.9 1.45 1.35 3.1 2.9 1.45 1.35 0.33 0.27 dimensions (mm are the original dimensions) sot639-2 mo-217 d h 0.33 0.27 b 1 0.38 0.32 b 3 0.38 0.32 b 2 2.45 e 3 e 0.23 0.17 f 0.5 w e yy 1 0.1 0.05 0.2 2.5 e 2 2.45 e 4 0.08 v 0 2.5 5 mm scale sot639-2 hbcc16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm a max. detail x y y 1 c e e e 1 e 3 d h e 4 d e x c b a 16 113 59 e 2 1/2 e 3 1/2 e 4 e h a 1 a 2 a b 2 b 1 b 3 b f terminal 1 index area a c c b v m w m a c c b v m w m a c c b v m w m a c c b v m w m
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 19 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. fig 15. hvqfn16 package outline. terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 3.1 2.9 d h 1.75 1.45 y 1 3.1 2.9 1.75 1.45 e 1 1.5 e 2 1.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot758-1 mo-220 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot758-1 hvqfn16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 58 16 13 12 9 4 1 x d e c b a e 2 02-03-25 02-10-21 terminal 1 index area 1/2 e 1/2 e a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1)
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 20 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. fig 16. tssop16 package outline. unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot403-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 18 16 9 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 a max. 1.1 pin 1 index
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 21 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 15. packaging the isp1105/1106w (hbcc16 package) is delivered on a type a carrier tape, see figure 17 . the tape dimensions are given in ta b l e 1 7 . the reel diameter is 330 mm. the reel is made of polystyrene (ps) and is not designed for use in a baking process. the cumulative tolerance of 10 successive sprocket holes is 0.02 mm. the camber must not exceed 1 mm in 100 mm. fig 17. carrier tape dimensions. table 17: type a carrier tape dimensions for isp1105/1106w dimension value unit a 0 3.3 mm b 0 3.3 mm k 0 1.1 mm p 1 8.0 mm w 12.0 0.3 mm i dth mlc338 type b type a b0 4 w k0 a0 4 k0 a0 p1 b0 p1 elongated sprocket hole direction of feed w direction of feed
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 22 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 16. soldering 16.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. in these situations re?ow soldering is recommended. 16.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 to 270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 16.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 23 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 16.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 16.5 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . table 18: suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, uson, vfbga not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5][6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 24 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop, tssop, vso and vsop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages.
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 25 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 17. additional soldering information 17.1 (h)bcc packages: footprint the surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (au, pd, ni and pd). the au + pd layer (0.1 m m min.) ensures solderability, the ni layer (5 m m min.) prevents diffusion, and the pd layer on top (0.5 m m min.) ensures effective wire bonding. 17.2 (h)bcc packages: re?ow soldering pro?le the conditions for re?ow soldering of (h)bcc packages are as follows: ? preheating time : minimum 90 s at t = 145 to 155 c ? soldering time : minimum 90 s (bcc) or minimum 100 s (hbcc) at t > 183 c ? peak temperature : C ambient temperature: t amb(max) = 260 c C device surface temperature: t case(max) = 255 c. cavity : exposed die pad, either functioning as heatsink or as ground connection; only for hbcc packages. fig 18. (h)bcc footprint and solder resist mask dimensions. 004aaa123 b 1 b b 2 d h 0.05 all dimensions in mm for exact dimensions see package outline drawing (sot639-2) normal terminal pcb land solder resist mask stencil mask solder land corner 0.05 b 2 b 2 b 2 e h 0.05 0.05 0.05 0.05 0.05 0.1 (4 ) 0.3 (8 ) 0.05 solder resist solder stencil b 1 b stencil print thickness: 0.1 to 0.12 mm cavity 0.05 0.05 d h e h
philips semiconductors isp1105/1106 advanced usb transceivers product data rev. 08 19 february 2004 26 of 28 9397 750 11231 ? koninklijke philips electronics n.v. 2004. all rights reserved. 18. revision history table 19: revision history rev date cpcn description 08 20040219 - product data (9397 750 11231); removed isp1107 related information. modi?cations: ? changed the data sheet title from isp1105/1106/1107 to isp1105/1106 and removed all information pertaining to isp1107 ? changed usb 1.1 reference to usb 2.0; also added data transfer rates ? added hvqfn16 package details in ta bl e 1 , section 6 and section 14 ? figure 1 : removed the ?rst ?gure note ? ta bl e 3 : added pad details ? ta bl e 1 1 : updated ? ta bl e 1 5 : removed z drv2 , and also table note 3 ? figure 8 and figure 10 : changed 1.65 v to 1.8 v. 07 20020329 - product data (9397 750 09529) 06 20011130 - product data; sixth version (9397 750 08872) 05 20010903 - product data; ?fth version (9397 750 08681) 04 20010802 - preliminary data; fourth version (9397 750 08643) 03 20010704 - preliminary data; third version (9397 750 08515) 02 20010205 - objective speci?cation; second version (9397 750 07879) isp1107 stand-alone data sheet only. 01 20000223 - objective speci?cation; initial version (9397 750 06899) isp1107 stand-alone data sheet only.
9397 750 11231 philips semiconductors isp1105/1106 advanced usb transceivers ? koninklijke philips electronics n.v. 2004. all rights reserved. product data rev. 08 19 february 2004 27 of 28 contact information for additional information, please visit http://www.semiconductors.philips.com . for sales of?ce addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com . fax: +31 40 27 24825 19. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 20. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 21. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. level data sheet status [1] product status [2][3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2004. printed in the netherlands all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 19 february 2004 document order number: 9397 750 11231 contents philips semiconductors isp1105/1106 advanced usb transceivers 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4.1 ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 functional description . . . . . . . . . . . . . . . . . . . 7 7.1 function selection. . . . . . . . . . . . . . . . . . . . . . . 7 7.2 operating functions. . . . . . . . . . . . . . . . . . . . . . 7 7.3 power supply con?gurations . . . . . . . . . . . . . . . 8 7.4 power supply input options . . . . . . . . . . . . . . . . 9 8 electrostatic discharge (esd). . . . . . . . . . . . . 10 8.1 esd protection . . . . . . . . . . . . . . . . . . . . . . . . 10 8.2 esd test conditions . . . . . . . . . . . . . . . . . . . . 10 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 10 recommended operating conditions. . . . . . . 11 11 static characteristics. . . . . . . . . . . . . . . . . . . . 12 12 dynamic characteristics . . . . . . . . . . . . . . . . . 15 13 test information . . . . . . . . . . . . . . . . . . . . . . . . 17 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 15 packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 16 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.2 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 16.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22 16.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 23 16.5 package related soldering information . . . . . . 23 17 additional soldering information . . . . . . . . . . 25 17.1 (h)bcc packages: footprint . . . . . . . . . . . . . . 25 17.2 (h)bcc packages: re?ow soldering pro?le. . . 25 18 revision history . . . . . . . . . . . . . . . . . . . . . . . . 26 19 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 27 20 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 21 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

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